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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Surface-based PEEC formulation for modeling conductors and dielectrics in time and frequency domain combined circuit electromagnetic simulations

✍ Scribed by Gope, D.; Ruehli, A.; Jandhyala, V.

Book ID: 126468059
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 261 KB
Category: Article
ISBN-13: 9780780386679
DOI: 10.1109/EPEP.2004.1407625

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