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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package

✍ Scribed by Rowlands, M.J.; Rosser, S.G.

No coin nor oath required. For personal study only.

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