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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Thermo-Mechanical Characterization of Copper Through-Wafer Interconnects

✍ Scribed by Miranda, P.A.; Moll, A.J.

Book ID: 120614422
Publisher: IEEE
Year: 2006
Weight: 704 KB
Category: Article
ISBN-13: 9781424401529
DOI: 10.1109/ECTC.2006.1645756

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