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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Fabrication and Electrical Characterization of 3D Vertical Interconnects

✍ Scribed by Newman, M.W.; Muthukumar, S.; Schuelein, M.; Dambrauskas, T.; Dunaway, P.A.; Jordan, J.M.; Kulkarni, S.; Linde, C.D.; Opheim, T.A.; Stingel, R.A.; Worwag, W.; Topic, L.A.; Swan, J.M.

Book ID: 120584954
Publisher: IEEE
Year: 2006
Weight: 743 KB
Category: Article
ISBN-13: 9781424401529
DOI: 10.1109/ECTC.2006.1645676

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