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[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Tightly coupling LTCC microwave coupled lines: analysis, modeling and realization

✍ Scribed by Deng, J.D.S.; Feng-ka Hsiao, ; Kuo, J.I.; Kuo Young Horng, ; Ching-Yuan Lee, ; Chung-Sen Wu,

Book ID: 121230058
Publisher: IEEE
Year: 2002
Weight: 288 KB
Category: Article
ISBN-13: 9780780376823
DOI: 10.1109/EMAP.2002.1188871

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