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[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - The introduction of MEMS packaging technology

✍ Scribed by Hsieh, C.T.; Jyh-Ming Ting, ; Yang, C.; Chung, C.K.

Book ID: 120254618
Publisher: IEEE
Year: 2002
Weight: 322 KB
Category: Article
ISBN-13: 9780780376823
DOI: 10.1109/EMAP.2002.1188855

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