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[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Electrical characterization of BGA test socket for high-speed applications

✍ Scribed by Ming-Kun Chen, ; Cheng-Chi Tai, ; Yu-Jung Huang, ; Li-Kuei Fang,

Book ID: 115479087
Publisher: IEEE
Year: 2002
Weight: 227 KB
Volume: 0
Category: Article
ISBN-13: 9780780376823
DOI: 10.1109/emap.2002.1188824

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