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[IEEE 40th Conference on Electronic Components and Technology - Las Vegas, NV, USA (20-23 May 1990)] 40th Conference Proceedings on Electronic Components and Technology - A comparison of copper and gold wire bonding on integrated circuit devices

✍ Scribed by Khoury, S.L.; Burkhard, D.J.; Galloway, D.P.; Scharr, T.A.

Book ID: 125470029
Publisher: IEEE
Year: 1990
Weight: 866 KB
Category: Article
DOI: 10.1109/ectc.1990.122277

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