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[IEEE 40th Conference on Electronic Components and Technology - Las Vegas, NV, USA (20-23 May 1990)] 40th Conference Proceedings on Electronic Components and Technology - Structural effect of IC plastic package on residual stress in silicon chips

✍ Scribed by Miura, H.; Nishimura, A.; Kawai, S.; Murakami, G.

Book ID: 120834081
Publisher: IEEE
Year: 1990
Weight: 525 KB
Category: Article
DOI: 10.1109/ECTC.1990.122208

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