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[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Investigation of temperature and moisture effect on interface toughness of EMC and copper using cohesive zone modeling method

✍ Scribed by Xiaosong Ma, ; Zhang, G.Q.

Book ID: 127317275
Publisher: IEEE
Year: 2014
Weight: 892 KB
Category: Article
ISBN: 1479947911
DOI: 10.1109/eurosime.2014.6813781

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