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[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wafer test probe burn modeling and characterization

✍ Scribed by Zafer, B.; Vishkasougheh, M. H.; Tunaboylu, B.

Book ID: 126642302
Publisher: IEEE
Year: 2013
Weight: 849 KB
Category: Article
ISBN: 1467361372
DOI: 10.1109/EuroSimE.2013.6529912

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