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[IEEE 2013 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA (2013.4.14-2013.4.18)] 2013 IEEE International Reliability Physics Symposium (IRPS) - Electromigration reliability of Mn-doped Cu interconnects for the 28 nm technology

✍ Scribed by Linjun Cao, ; Ho, P. S.; Justison, P.

Book ID: 120582472
Publisher: IEEE
Year: 2013
Weight: 792 KB
Category: Article
ISBN: 1479901113
DOI: 10.1109/IRPS.2013.6532080

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