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[IEEE 2013 IEEE International Electron Devices Meeting (IEDM) - Washington, DC, USA (2013.12.9-2013.12.11)] 2013 IEEE International Electron Devices Meeting - Superior Cu fill with highly reliable Cu/ULK integration for 10nm node and beyond

✍ Scribed by Matsuda, T.; Lee, J. J.; Han, K. H.; Park, K. H.; Cha, J. O.; Baek, J. M.; Yim, T. J.; Kim, D. C.; Lee, D. H.; Kim, J. N.; Choi, S. H.; Lee, E. B.; Nam, S. D.; Lee, H. B.; Cho, Y. W.; Kim, I. S.; Kwon, B. H.; Ahn, S. H.; Yun, J. H.; Kim, B. H.; Yoon, B. U.; Hong, J. S.; Lee, N. I.; Choi, S.; Kang, H. K.; Chung, E. S.

Book ID: 121795840
Publisher: IEEE
Year: 2013
Weight: 474 KB
Category: Article
ISBN: 1479923060
DOI: 10.1109/IEDM.2013.6724715

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