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[IEEE 2013 22nd Asian Test Symposium (ATS) - Yilan County, Taiwan (2013.11.18-2013.11.21)] 2013 22nd Asian Test Symposium - A TSV Repair Scheme Using Enhanced Test Access Architecture for 3-D ICs

✍ Scribed by Yang, Chi-Chun; Chou, Che-Wei; Li, Jin-Fu

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