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[IEEE 2013 17th IEEE Workshop on Signal and Power Integrity (SPI) - Paris, France (2013.05.12-2013.05.15)] 2013 17th IEEE Workshop on Signal and Power Integrity - Modeling and minimizing the inductance of bond wire interconnects

✍ Scribed by Ndip, Ivan; Oz, Abdurrahman; Guttowski, Stephan; Reichl, Herbert; Lang, Klaus-Dieter; Henke, Heino

Book ID: 120977691
Publisher: IEEE
Year: 2013
Weight: 984 KB
Category: Article
ISBN: 1467356778
DOI: 10.1109/SaPIW.2013.6558344

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