[IEEE 2012 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2012.12.10-2012.12.13)] 2012 International Electron Devices Meeting - Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals

✍ Scribed by Nogami, T.; Penny, C.; Madan, A.; Parks, C.; Li, J.; Flaitz, P.; Uedono, A.; Chiang, S.; He, M.; Simon, A.; Bolom, T.; Ryan, T.; Ito, F.; Christiansen, C.; Tai, L.; Hu, C-K.; Kim, H.; Zhang, X.; Tanwar, K.; Choi, S.; Baumann, F.; Davis, R.; Kelly, J.; Murphy, R.; Molis, S.; Rowland, J.; Dehaven, P.; Canaperi, D.; Spooner, T.; Edelstein, D.

• Book ID: 120200919
• Publisher: IEEE
• Year: 2012
• Weight: 801 KB
• Category: Article
• ISBN: 1467348708
• DOI: 10.1109/IEDM.2012.6479161