𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Noise coupling analysis between TSV and active circuit

✍ Scribed by Lee, Manho; Cho, Jonghyun; Kim, Joungho

Book ID: 120167394
Publisher: IEEE
Year: 2012
Weight: 987 KB
Category: Article
ISBN: 1467314455
DOI: 10.1109/EDAPS.2012.6469428

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 IEEE Electrical Design of Adv

[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Propagation characteristics of differential transmission lines in hybrid-laminated materials

✍ Liao, Chun-Lin; Ho, Danny; Kuo, Evelyn; Lai, David 📂 Article 📅 2012 🏛 IEEE ⚖ 1003 KB

[IEEE 2012 IEEE Electrical Design of Adv

[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A linear 4-element model of VRM —Characteristics, practical uses and limitations

✍ Hsiung, Edward Hsin-Kuan; Li, Yuan-Liang; Wu, Ruey-Beei; Su, Thonas; Cheng, Yung 📂 Article 📅 2012 🏛 IEEE ⚖ 996 KB

[IEEE 2012 IEEE Electrical Design of Adv

[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Slow-wave structure to suppress differential-to-common mode conversion for bend discontinuity of differential signaling

✍ Wu, Lin-Sheng; Mao, Jun-Fa; Yin, Wen-Yan 📂 Article 📅 2012 🏛 IEEE ⚖ 1007 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Research on TSV positioning in 3D IC placement

✍ Ligang Hou, ; Shu Bai, ; Jinhui Wang, 📂 Article 📅 2011 🏛 IEEE ⚖ 375 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Design of INMARSAT ground terminal antenna

✍ Yu, Daqun; Zhu, Ruiping; He, Bingfa 📂 Article 📅 2011 🏛 IEEE ⚖ 145 KB

[IEEE 2011 IEEE Electrical Design of Adv

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Design of multi-band microstrip power dividers

✍ Chu, Qing-Xin; Lin, Feng 📂 Article 📅 2011 🏛 IEEE ⚖ 230 KB