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[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou, China (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Design of multi-band microstrip power dividers

✍ Scribed by Chu, Qing-Xin; Lin, Feng

Book ID: 120661988
Publisher: IEEE
Year: 2011
Weight: 230 KB
Category: Article
ISBN: 146732289X
DOI: 10.1109/EDAPS.2011.6213762

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