𝔖 Bobbio Scriptorium

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[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design

✍ Scribed by Chang, Yu-Jen; Chuang, Hao-Hsiang; Lu, Yi-Chang; Chiou, Yih-Peng; Wu, Tzong-Lin; Chen, Peng-Shu; Wu, Shih-Hsien; Kuo, Tzu-Ying; Zhan, Chau-Jie; Lo, Wei-Chung

Book ID: 125495874
Publisher: IEEE
Year: 2012
Weight: 711 KB
Category: Article
ISBN: 1467325376
DOI: 10.1109/EPEPS.2012.6457884

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