𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Thermal analysis of thin film transistor liquid crystal display (TFT-LCD) TV panels with single sided LED bars

✍ Scribed by Tavman, Ismail; Turgut, Alpaslan; Iz, Murat

Book ID: 121358508
Publisher: IEEE
Year: 2012
Weight: 513 KB
Category: Article
ISBN: 1467347574
DOI: 10.1109/SIITME.2012.6384343

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Real-time sensor acquisition interfacing using MatLAB

✍ Bande, Vlad; Pop, Septimiu; Ciascai, Ioan; Pitica, Dan 📂 Article 📅 2012 🏛 IEEE ⚖ 275 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - A Matlab tool for simulations of power resonant converters

✍ Taut, Adrian; Pop, Ovidiu 📂 Article 📅 2012 🏛 IEEE ⚖ 215 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Software in the Loop environment reliability for testing embedded code

✍ Muresan, Marius; Pitica, Dan 📂 Article 📅 2012 🏛 IEEE ⚖ 542 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering

✍ Geczy, Attila; Kvanduk, Biborka; Illes, Balazs; Illyefalvi-Vitez, Zsolt 📂 Article 📅 2012 🏛 IEEE ⚖ 421 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - An embedded architecture for distributed processing: A practical solution for combining peripherals and digital processing

✍ Avadanii, A.; Nicolae, M. 📂 Article 📅 2012 🏛 IEEE ⚖ 629 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Over-current and short-circuit protection for IGBT's used in plasma generator inverter

✍ Ciocan, Ionut; Farcas, Cristian; Petreus, Dorin; Palaghita, Niculaie; Grama, Ali 📂 Article 📅 2012 🏛 IEEE ⚖ 150 KB