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[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Sideways FIB TEM sample preparation for improved construction analysis in TEM

✍ Scribed by Chong, H. B.; Van Leer, Brandon; Narang, V.; Ho, M. Y.

Book ID: 126754815
Publisher: IEEE
Year: 2012
Weight: 530 KB
Category: Article
ISBN: 1467309826
DOI: 10.1109/IPFA.2012.6306257

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