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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Void free filling of TSV vias by bottom up copper electroplating for wafer level MEMS vacuum packaging

✍ Scribed by Xu, Chunlin; Wang, Xuefang; Wang, Yuzhe; Xu, Minghai; Hu, Chang; Liu, Sheng

Book ID: 126768284
Publisher: IEEE
Year: 2012
Weight: 973 KB
Category: Article
ISBN: 1467316806
DOI: 10.1109/ICEPT-HDP.2012.6474571

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