𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Comparison of LED package reliability under thermal cycling and thermal shock conditions by experimental testing and finite element simulation

✍ Scribed by Chen, Zhaohui; Zhang, Qin; Chen, Run; Jiao, Feng; Chen, Mingxiang; Luo, Xiaobing; Liu, Sheng

Book ID: 125833155
Publisher: IEEE
Year: 2011
Weight: 580 KB
Category: Article
ISBN: 1612844979
DOI: 10.1109/ECTC.2011.5898550

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2011 IEEE 61st Electronic Componen

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Microfluidic printed circuit boards

✍ Wu, Liang Li; Babikian, Sarkis; Li, Guann-Pyng; Bachman, Mark 📂 Article 📅 2011 🏛 IEEE ⚖ 1002 KB

[IEEE 2011 IEEE 61st Electronic Componen

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Metamaterial-inspired absorbers for Terahertz packaging applications

✍ Park, Kyoung Youl; Hejase, Jose A.; Meierbachtol, Collin S.; Wiwatcharagoses, No 📂 Article 📅 2011 🏛 IEEE ⚖ 1021 KB

[IEEE 2011 IEEE 61st Electronic Componen

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Graphene based RF/microwave impedance sensing of DNA

✍ Iramnaaz, I.; Xing, Y.; Xue, K.; Zhuang, Y.; Fitch, R. 📂 Article 📅 2011 🏛 IEEE ⚖ 920 KB

[IEEE 2011 IEEE 61st Electronic Componen

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Investigations of the water-borne isotropically conductive adhesives

✍ Yang, Cheng; Yuen, Matthew M F; Chen, Guohua; Li, Zhongyu; Wong, C P 📂 Article 📅 2011 🏛 IEEE ⚖ 909 KB

[IEEE 2011 IEEE 61st Electronic Componen

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Ultra thin PoP top package using compression mold: Its warpage control

✍ Yim, Myung Jin; Strode, Richard; Brand, Jason; Adimula, Ravikumar; Zhang, James 📂 Article 📅 2011 🏛 IEEE ⚖ 767 KB

[IEEE 2011 IEEE 61st Electronic Componen

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Silicon-based wafer-level packaging for cost reduction of high brightness LEDs

✍ Uhrmann, Thomas; Matthias, Thorsten; Lindner, Paul 📂 Article 📅 2011 🏛 IEEE ⚖ 696 KB