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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Silicon-based wafer-level packaging for cost reduction of high brightness LEDs

✍ Scribed by Uhrmann, Thomas; Matthias, Thorsten; Lindner, Paul

Book ID: 120985948
Publisher: IEEE
Year: 2011
Weight: 696 KB
Category: Article
ISBN: 1612844979
DOI: 10.1109/ECTC.2011.5898728

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