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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Ultra thin PoP top package using compression mold: Its warpage control

✍ Scribed by Yim, Myung Jin; Strode, Richard; Brand, Jason; Adimula, Ravikumar; Zhang, James Jian; Yoo, Chan

Book ID: 121881469
Publisher: IEEE
Year: 2011
Weight: 767 KB
Category: Article
ISBN: 1612844979
DOI: 10.1109/ECTC.2011.5898654

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