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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Modeling of electromigration in through-silicon-via based 3D IC

✍ Scribed by Pak, Jiwoo; Pathak, Mohit; Lim, Sung Kyu; Pan, David Z.

Book ID: 125793544
Publisher: IEEE
Year: 2011
Weight: 749 KB
Category: Article
ISBN: 1612844979
DOI: 10.1109/ECTC.2011.5898698

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