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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Multi-objective optimization of microprocessor package vertical interconnects

✍ Scribed by Li, Ying; Jandhyala, Vikram; Braunisch, Henning

Book ID: 127168800
Publisher: IEEE
Year: 2011
Weight: 541 KB
Category: Article
ISBN: 1612844979
DOI: 10.1109/ectc.2011.5898557

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