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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Analysis of CNT based 3D TSV for emerging RF applications

✍ Scribed by Gupta, Anurag; Kim, Bruce C.; Kannan, Sukeshwar; Evana, Sai Shravan; Li, Li

Book ID: 125539022
Publisher: IEEE
Year: 2011
Weight: 604 KB
Category: Article
ISBN: 1612844979
DOI: 10.1109/ECTC.2011.5898800

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