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[IEEE 2010 IEEE International Test Conference (ITC) - Austin, TX, USA (2010.11.2-2010.11.4)] 2010 IEEE International Test Conference - Modeling TSV open defects in 3D-stacked DRAM

✍ Scribed by Jiang, Li; Liu, Yuxi; Duan, Lian; Xie, Yuan; Xu, Qiang

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