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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Die-attach for high-temperature applications using fineplacer-pressure-sintering (FPS)

✍ Scribed by Kahler, Julian; Heuck, Nicolas; Palm, Gerhard; Stranz, Andrej; Waag, Andreas; Peiner, Erwin

Book ID: 126958108
Publisher: IEEE
Year: 2010
Weight: 829 KB
Category: Article
ISBN: 1424485533
DOI: 10.1109/estc.2010.5642808

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