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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - On the integration of microwave curing systems into microelectronics assembly processes

✍ Scribed by Adamietz, R.; Muller, G.; Othman, N.; Eicher, F.; Tilford, T.; Ferenets, M.; Pavuluri, S.K.; Desmulliez, M.P.Y.; Bailey, C.

Book ID: 118149359
Publisher: IEEE
Year: 2010
Weight: 918 KB
Volume: 0
Category: Article
ISBN: 1424485533
DOI: 10.1109/estc.2010.5642827

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