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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Anodic bonding at low voltage using microstructured borosilicate glass thin-films

✍ Scribed by Leib, Juergen; Hansen, Ulli; Maus, Simon; Feindt, Holger; Hauck, Karin; Zoschke, Kai; Toepper, Michael

Book ID: 121008695
Publisher: IEEE
Year: 2010
Weight: 605 KB
Category: Article
ISBN: 1424485533
DOI: 10.1109/ESTC.2010.5642923

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