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[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Cooling microprocessors using vapor compression refrigeration

✍ Scribed by Davies, Gareth F.; Eames, Ian W.; Bailey, Paul; Dadd, Michael W.; Janiszewski, Adam; Stone, Richard; Maidment, Graeme G.; Agnew, Brian

Book ID: 126232081
Publisher: IEEE
Year: 2010
Weight: 858 KB
Category: Article
ISBN: 1424453429
DOI: 10.1109/ITHERM.2010.5501390

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