𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal conductivity and boundary resistance measurements of GeSbTe and electrode materials using nanosecond thermoreflectance

✍ Scribed by Bozorg-Grayeli, E.; Reifenberg, J.P.; Chang, K.W.; Panzer, M.; Goodson, K.E.

Book ID: 121678907
Publisher: IEEE
Year: 2010
Weight: 327 KB
Category: Article
ISBN: 1424453429
DOI: 10.1109/itherm.2010.5501263

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -

✍ Patel, Chandradip; McCluskey, Patrick; Lemus, David 📂 Article 📅 2010 🏛 IEEE ⚖ 605 KB

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal conduction through diamond - silicon heterostructures

✍ Goyal, V.; Kotchetkov, D.; Subrina, S.; Rahman, M.; Balandin, A.A. 📂 Article 📅 2010 🏛 IEEE ⚖ 630 KB

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Cooling microprocessors using vapor compression refrigeration

✍ Davies, Gareth F.; Eames, Ian W.; Bailey, Paul; Dadd, Michael W.; Janiszewski, A 📂 Article 📅 2010 🏛 IEEE ⚖ 858 KB

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Extraordinary thermal conductivity of graphene: Possibility of thermal management applications

✍ Ghosh, S.; Subrina, S.; Goyal, V.; Nika, D.L.; Pokatilov, E.P.; Balandina, A.A. 📂 Article 📅 2010 🏛 IEEE ⚖ 342 KB

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Mechanical challenge of frameless PV-modules

✍ Weller, Bernhard; Tautenhahn, Lutz 📂 Article 📅 2010 🏛 IEEE ⚖ 312 KB

[IEEE 2010 12th IEEE Intersociety Confer

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Design challenges of thermal margining tools for silicon validation

✍ Mohammed, Rahima K.; Sahan, Ridvan A.; Prabhugoud, Mohanraj 📂 Article 📅 2010 🏛 IEEE ⚖ 987 KB