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[IEEE 2009 IEEE Workshop on Microelectronics and Electron Devices (WMED) - Boise, Idaho, USA (2009.04.3-2009.04.3)] 2009 IEEE Workshop on Microelectronics and Electron Devices - Analysis and Optimization of Packaging Structures to Maximize the Thermal Performance of Multi-Finger GaInP/GaAs Collector-Up HBTs

✍ Scribed by Tseng, Hsien-Cheng; Chen, Jhin-Yuan

No coin nor oath required. For personal study only.

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