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[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A conformal mapping based approach for fast two-dimensional FEM electrostatic analysis of MEMS devices without re-meshing

โœ Scribed by Sumant, Prasad S.; Cangellaris, Andreas C.; Aluru, Narayana R.


Book ID
125425897
Publisher
IEEE
Year
2009
Tongue
English
Weight
542 KB
Category
Article
ISBN
1424441609

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