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[IEEE 2007 IEEE Symposium on VLSI Technology - Kyoto, Japan (2007.06.12-2007.06.14)] 2007 IEEE Symposium on VLSI Technology - Reliable 3D Damascene MIM architecture embedded into Cu interconnect for a Ta2O5 capacitor record density of 17 fF/¿m2

✍ Scribed by Thomas, M.; Farcy, A.; Perrot, C.; Deloffre, E.; Gros-Jean, M.; Benoit, D.; Richard, C.; Caubet, P.; Guillaumet, S.; Pantel, R.; Cordeau, M.; Piquet, J.; Bermond, C.; Flechet, B.; Chenevier, B.; Torres, J.

Book ID: 121851197
Publisher: IEEE
Year: 2007
Tongue: Japanese
Weight: 836 KB
Category: Article
ISBN: 4900784036
DOI: 10.1109/VLSIT.2007.4339726

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