𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2007 IEEE Electrical Performance of Electronic Packaging - Atlanta, GA, USA (2007.10.29-2007.10.31)] 2007 IEEE Electrical Performance of Electronic Packaging - Parallel Simulation of High-Speed Interconnects using Delay Extraction and Transverse Partitioning

✍ Scribed by Nakhla, Natalie; Nakhla, Michel; Achar, Ram; Ruehli, Albert

Book ID: 126846784
Publisher: IEEE
Year: 2007
Weight: 537 KB
Category: Article
ISBN: 1424408830
DOI: 10.1109/epep.2007.4387170

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Simulation of coupled interconnects using waveform relaxation and transverse partitioning

✍ Nakhla, N.; Ruehli, A.; Nakhla, M.; Achar, R. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 204 KB

[IEEE 2008 IEEE 17th Conference on Elect

[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Parallel algorithm for analysis of high-speed interconnects

✍ Paul, D.; Nakhla, N. M.; Achar, R.; Nakhla, M. S. 📂 Article 📅 2008 🏛 IEEE ⚖ 346 KB

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Transmitter and channel equalization for high-speed server interconnects

✍ de Araujo, D.N.; Diepenbrock, J.; Cases, M.; Pham, N. 📂 Article 📅 2003 🏛 IEEE ⚖ 297 KB

[IEEE IEEE 10th Topical Meeting on Elect

[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Modeling of interconnects and electromagnetic field distributions using FDTD method

✍ Watanabe, T.; Suzuki, M.; Kamo, A.; Asai, H. 📂 Article 📅 2001 🏛 IEEE ⚖ 430 KB

[IEEE IEEE 10th Topical Meeting on Elect

[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

✍ Coperich, K.M.; Morsey, J.; Cangellaris, A.C.; Ruehli, A. 📂 Article 📅 2001 🏛 IEEE ⚖ 290 KB

[IEEE 2012 IEEE 21st Conference on Elect

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Ultra-high speed memory bus using microwave interconnects

✍ Aberle, James T.; Bensalem, Brahim 📂 Article 📅 2012 🏛 IEEE ⚖ 408 KB