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[IEEE IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, USA (29-31 Oct. 2001)] IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) - Modeling of interconnects and electromagnetic field distributions using FDTD method

✍ Scribed by Watanabe, T.; Suzuki, M.; Kamo, A.; Asai, H.

Book ID: 126642299
Publisher: IEEE
Year: 2001
Weight: 430 KB
Category: Article
ISBN-13: 9780780370241
DOI: 10.1109/EPEP.2001.967638

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