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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - MCP Bottom Die Crack Issue during Destructive Analysis

✍ Scribed by Jiang, Yuqi; Song, Xianzhong; Lam, TimFai; Wu, Caihong; Sun, Mingxia; Wang, Xiangru; Li, Xiaoqing

No coin nor oath required. For personal study only.

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