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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Lead Free Micro Bumping - Cost & Yield Challenges

✍ Scribed by Ruhmer, Klaus; Hughlett, Emmett; Ishizuka, Masahiko; Kojima, Tomoaki; Asaka, Takeshi; Dang, Bing; Buchwalter, Steve; Shih, Da-Yuan

Book ID: 125830115
Publisher: IEEE
Year: 2007
Weight: 804 KB
Category: Article
ISBN: 1424413230
DOI: 10.1109/EPTC.2007.4469694

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