✦ LIBER ✦

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Effect of Wire Purity on Copper Wire Bonding

✍ Scribed by Srikanth, Narasimalu; Premkumar, J.; Sivakumar, M.; Wong, Y. M.; Vath, C. J.

No coin nor oath required. For personal study only.

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