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[IEEE 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. - Honolulu, HI, USA (June 13-15, 2006)] 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. - Integration of Self-Formed Barrier Technology for 32nm-Node Cu Dual-Damascene Interconnects with Hybrid Low-k (PAr/SiOC) Structure

✍ Scribed by Ohoka, Y.; Inoue, K.; Hayashi, T.; Komai, N.; Arakawa, S.; Kanamura, R.; Kadomura, S.

No coin nor oath required. For personal study only.

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