[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - A Vertical Wafer Level Packaging using Through Hole Filled Via Interconnects by Lift Off Polymer Method for MEMS and 3D Stacking Applications

[IEEE 2005 55th Electronic Components an

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[IEEE 2005 55th Electronic Components an

✍ Paproth, A.; Wolter, K.-J.; Friedrich, J.; Deltschew, R. 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 407 KB

[IEEE 2005 55th Electronic Components an

✍ Chan, E.K.L.; Wong, C.K.Y.; Lee, L.M.; Yuen, M.M.F.; Yi-Kuen Lee, 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 564 KB

[IEEE 2005 55th Electronic Components an

✍ Yi-Ming Chen, ; Cheng-Lin Yang, ; Yao-Ling Cheng, ; Hsiu-Hsiang Chen, ; Ying-Chi 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 1000 KB

[IEEE 2005 55th Electronic Components an

✍ Itoi, K.; Sato, M.; Okada, K.; Masu, K.; Ito, T. 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 706 KB

[IEEE 2005 55th Electronic Components an

✍ Raj Bahadur, ; Avram Bar-Cohen, 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 377 KB