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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Metal-polymer composites for molded interconnect devices (MID)

✍ Scribed by Paproth, A.; Wolter, K.-J.; Friedrich, J.; Deltschew, R.

Book ID: 124097542
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 407 KB
Volume: 2
Category: Article
ISBN-13: 9780780389069
DOI: 10.1109/ECTC.2005.1442056

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