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[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Using PDMS Micro-Transfer Moulding for Polymer Flip Chip Packaging on MEMS

✍ Scribed by Chan, E.K.L.; Wong, C.K.Y.; Lee, L.M.; Yuen, M.M.F.; Yi-Kuen Lee,

Book ID: 120969307
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 564 KB
Volume: 2
Category: Article
ISBN-13: 9780780389069
DOI: 10.1109/ECTC.2005.1441404

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