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[IEEE 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 - Singapore (9-13 July 2001)] Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548) - Solder joint fatigue and reliability of chip scale packages: a failure analysis strategy

✍ Scribed by Mohamed, S.; Francis, C.; Lam Boon Yew, ; Tang Wye Mun, ; Lim Too Ki,

Book ID: 126669969
Publisher: IEEE
Year: 2001
Weight: 704 KB
Category: Article
ISBN-13: 9780780366756
DOI: 10.1109/IPFA.2001.941473

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