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[IEEE 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual - Denver, CO, USA (8-10 April 1997)] 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual - Towards a nondestructive procedure for characterization of molding compounds

✍ Scribed by Canumalla, S.; Kessler, L.W.

Book ID: 126607455
Publisher: IEEE
Year: 1997
Weight: 630 KB
Category: Article
ISBN-13: 9780780335752
DOI: 10.1109/RELPHY.1997.584252

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