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[IEEE 15th Biennial University/Government/Industry Microelectronics Symposium - Boise, ID, USA (30 June-2 July 2003)] Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488) - Rectangular polysilicon diaphragms: fabrication and characterization

✍ Scribed by Woods, E.V.; Zhiping Zhou,

Book ID: 126633957
Publisher: IEEE
Year: 2003
Weight: 146 KB
Category: Article
ISBN-13: 9780780379725
DOI: 10.1109/UGIM.2003.1225769

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