High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates

✍ Scribed by Toshihide Takahashi; Shuichi Komatsu; Hiroshi Nishikawa; Tadashi Takemoto

• Book ID: 107457007
• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 740 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1326-x